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Micrel, Inc.
Absolute Maximum Ratings (1)
Supply Voltage
(V DD 1.2, PLLDV DD 1.2, PLLSV DD 1.2,
USB1V DD 1.2, USB2V DD 1.2 ) .................. –0.5V to +1.6V
V DD 2.5…… ......……… …………………..–0.5V to +3.0V
(V DD 3.3, PLLV DD A3.3, PLLDV DD 3.3,
USB1V DD A3.3, USB2V DD A3.3,
USBCV DD A3.3)....................................... –0.5V to +4.0V
Input Voltage (all inputs) ........................... –0.5V to +4.0V
Output Voltage (all outputs) ...................... –0.5V to +4.0V
Pb-Free Temperature (soldering, 10sec.)...............260°C
Storage Temperature (T s ) ..................... –55°C to +150°C
Electrical Characteristics (4)
KSZ9692PB, KSZ9692PB-S
Operating Ratings (2)
Supply Voltage
(V DD 1.2, PLLDV DD 1.2, PLLSV DD 1.2,
USB1V DD 1.2, USB2V DD 1.2 ) ........ +1.235V to +1.365V
V DD 2.5 ............................................. +2.3V to +2.7V
(V DD 3.3, PLLV DD A3.3, PLLDV DD 3.3,
USB1V DD A3.3, USB2V DD A3.3,
USBCV DD A3.3)..................................... +3.0V to +3.6V
Ambient Temperature (T A )
Commercial .............................................0°C to +70°C
Industrial .............................................-40°C to +85°C
Junction Temperature (T J ) ..................................... 150°C
Package Thermal Resistance (3)
( θ JA ) No Air Flow ...................................23.4°C/W
1m/s ..............................................21.1°C/W
2m/s ..............................................20.2°C/W
( θ JC ) No Air Flow .....................................9.5°C/W
Symbol
Parameter
Condition
Min
Typ
Max
Units
Total Supply Current with WAN and LAN ports under 1000 Mbps Data Traffic, DDR clock = 200MHz
I 1.3V
VDD1.2, PLLDVDD1.2,
PLLSVDD1.2, USB1VDD1.2,
Single supply at 1.3V
595
mA
USB2VDD1.2
I 2.6V
I 3.3v
VDD2.5
VDD3.3, PLLVDDA3.3,
PLLDVDD3.3, USB1VDDA3.3,
Single supply at 2.6V
Single supply at 3.3V
160
116
mA
mA
USB2VDDA3.3, USBCVDDA3.3
TTL Inputs ( SDIO, Static Memory, UART, SPI, I2C, I2S, MDC/MDIO, GPIO)
V IH
V IL
Input High Voltage
Input Low Voltage
2.0
0.8
V
V
I IN
Input Current
(Excluding pull-up/pull-down)
V IN = GND ~ V DD3.3
–10
10
μA
TTL Outputs (SDIO, Static Memory, UART, SPI, I2C, I2S, MDC/MDIO, GPIO)
V OH
V OL
I OZ
Output High Voltage
Output Low Voltage
Output Tri-state Leakage
I OH = –8mA
I OL = 8mA
2.4
0.4
10
V
V
μA
PCI Electrical: Compliant to PCI version 2.3 Standard
DDR Electrical: Compliant to EIA/JEDEC standard EIA/JESD8-9 (Stub series terminated logic for 2.5V, SSTL_2)
USB 2.0 Electrical: Compliant to USB 2.0 Standard
RGMII Electrical: Compliant to Reduced Gigabit Media Independent Interface(RGMII) Version 1.3
(5)
MII Electrical: compliant to IEEE 802.3u Specification
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating. Unused inputs must always be tied to an appropriate logic voltage level (Ground
to V DD ).
3. No heat spreader in package.
4. TA = 25°C. Specification for packaged product only.
5. RGMII interface is standard 3.3V CMOS VIO. However “Reduced Gigabit Media Independent Interface(RGMII) Version 1.3” specification is based on
2.5V CMOS VIO. Therefore any chosen RGMII based PHY must be evaluated based on standard 3.3V CMOS VIO compatibility.
May 2011
42
M9999-051111-4.0
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